Liquid Cooling
For existing and evolving data centres — precision-engineered manifolds and integrated solutions for direct-to-chip liquid cooling.
Manifolds
Tate's Liquid Cooling Manifolds deliver coolant from the CDU to the coldplate, enabling direct-to-chip liquid cooling for high-density data centres. By regulating flow, pressure, and temperature, they ensure even heat dissipation across all servers, improving efficiency and performance.
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Ceiling Supported Manifolds
Tate's Ceiling suspended HAC and integrated liquid cooling manifolds act together as one integrated cooling solution, supporting multiple mounting options, including a multi-arm cantilever system that simplifies cable tray installation.
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Floor Mounted Manifolds
Installed withing the Tate Hot Aisle Containment System (HAC), these manifolds are ideal for high density environments where space and performance matter most. Their integrated design delivers liquid cooling right at the source ensuring thermal efficiency for AI and HPC workloads.
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Underfloor Manifolds
Designed for both new builds and retrofit, modular underfloor manifolds route cooling below the raised floor, minimising disruption and supporting fast installation. A practical options for scaling capacity while maintaining uptime.
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Floor Supported and Custom Configurations
When a standard layout isn't enough, our floor-supported and hybrid options provide flexibility for any site-specific constraint. These solutions adapt to unique layouts, combining in rack and underfloor or custom routing without compromising performance scalability or accessibility.
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